Founded in 2021 by industry veterans from semiconductor design and packaging, Silicon Box's co-founders include Dr. Sehat Sutardja and Weili Dai, former leaders at Marvell Technology Group, and Dr. Byung Joon (BJ) Han, ex-CEO of STATS ChipPAC. Dr. Sutardja and Dr. Han bring a combined portfolio of over 800 US patents and a rich history of collaboration.

Silicon Box’s Singapore factory specialises in effective chiplet integration, a concept introduced by Dr. Sutardja in 2015 at the ISSCC.

Dr. BJ Han stated: "Silicon Box is well poised to solve the semiconductor industry's challenges for fast adoption of chiplet. We are leading the pack to bring high performance, power-optimised, affordable, and scalable solutions that enable next-gen large language models (LLM), generative AI, automotive, data centres, and mobile computing globally. Our state-of-the-art factory and advanced panel level packaging are delivering a solution to scale high growth markets, such as AI accelerators, to the masses. This is our first multibillion-dollar factory, and we are eager to scale rapidly to support our customers and partners."

The company is making strides in semiconductor package design and fabrication, aiming to transform everything from advanced AI systems to simple circuits. Chiplet architecture, a specialty of Silicon Box, offers a flexible alternative to monolithic chip processing, enabling better performance, smaller sizes, and increased reliability.

Silicon Box's large production format sets new industry standards for large scale, high yield production, especially for advanced chiplet-based designs. Its solutions offer up to 90% cost reduction in manufacturing high-performance devices with superior thermal and electrical performance, crucial for the burgeoning AI accelerator market.

The company has already achieved remarkable outcomes in initial collaborations with customers. Ravi Krishnamoorthy, Vice President, and Managing Director at Zerro Power Systems, noted:

"We're deeply excited to partner with Silicon Box. Their unique packaging approach has dramatically shortened our time to market, while allowing us to gain a significant lead on our competitors."

Following a $200M Series B funding round, Silicon Box now has a valuation exceeding one billion dollars, with significant investments from founders and other strategic investors.

Andrew Homan of Maverick Capital commented: "As we bump up against size and cost constraints in front-end SoC design, chiplet architectures are emerging as an innovative solution given their higher manufacturing yields and functional reuse of IP, among other benefits. Especially as industry standards align, chiplet adoption should grow rapidly. Silicon Box is a key enabler of chiplet adoption, given its advanced packaging technologies that achieve industry leading interconnect density and power performance at a still cost-effective price point. We are committed to supporting BJ, Sehat, Weili and the Silicon Box team in catalysing this important paradigm shift in chip production."

Henry Huang from TDK Ventures remarked: "The Silicon Box chiplet design is truly innovation at its finest. The company’s recently opened 750,000 square foot facility has proven the concept is totally viable, and competitors in the industry have already taken notice. TDK Ventures is proud to be a part of their success and eagerly look forward to supporting their future endeavours."

Kwan Yoon of BRV Capital stated: "Chiplets are the future and what Silicon Box has achieved for chiplet deployment, in a short time, already represents significant breakthroughs for the industry. Our team was impressed that Silicon Box delivered the most innovative solutions that are high performance, energy conscious, reliable and affordable while addressing such a key industry bottleneck. Silicon Box and its technologies are extremely important for the semiconductor industry, and the digital world."